Shenzhen Xingkexun Electronics Co., Ltd. Contact: Mr. Wu Tel: 0755-81486688
Address: Block D, Yiyuanda Scientific Research Park, Shilong Community, Shiyan Street, Baoan District, Shenzhen, Guangdong.
What details should you pay attention to if you want to produce zero defective products during PCBA processing?
During PCBA processing and assembly, the control and management of each link has a great impact on quality assurance. During the assembly process, technical means can be effectively used to standardize the management of related results. At the same time, management means are used to achieve product quality and reduce costs. This is also the purpose for many users to choose a PCB patch processing factory. These factories have different management methods in terms of introduction of new products, selection of materials, SMT and assembly in manufacturing. After every detail is done to the extreme, you can implement the goal of zero defect in the whole process of PCBA patch processing. Specifically, it can be managed from the following aspects:
(1) Product design is the source.
The manufacturability of product design before PCBA processing directly affects the quality and quality of the product. This is also the source of improving product quality. The purpose of designing a new model is to find relevant design content, manufacturing conditions, parameters, etc. that are suitable for production. In order to provide effective design improvement suggestions during the new product design phase, after receiving gerber data and PCB manufacturing requirements, DFM can be used to explore and improve design manufacturability issues. Such as PCB size and panel design, positioning of 和 L and MARK points, rationality of pad design, matching of pads and electronic components, solderability of materials, automation of equipment, and soldering points of wave soldering design. After in-depth analysis, we will provide our customers with suggestions for improvement, which will effectively improve the product quality of our products. In order to regulate and manage design issues, design issues that can arise from PCBs can be listed as DFM audits. Before the test, according to the list on the DFM, the technicians of the technical staff are organized to confirm each time. This can better prevent the omission of design problems and affect the quality after mass production.
(2) Reasonable material selection is protection
The materials used for PCBA processing are mainly divided into main materials, auxiliary materials and other solvents used to clean the board. The main materials mainly refer to electronic components and PCB boards. The basic requirement for selection is to first ensure the weldability of the solderable ends of the parts, and then perform reliability and reliability tests to meet the quality, which has a lot to do with the coating treatment and processing of the surface layer of the parts. The gold-plated layer has good solderability but higher cost and is suitable for high-performance electronic products. Others are usually tinned. In addition, it is the matching of the external dimensions of the component and the foot of the component with the PCB hole and copper foil, and the assemblability. Achieving equipment is automated to ensure high quality and productivity goals. Secondary materials refer to solder paste, red glue, tin wire, tin bars, and tin water. These materials are mainly the core materials used to solder PCBs and components. When choosing, you must understand the compositional match between the solderable end of the material and the auxiliary material. At present, the industry uses more auxiliary materials combined with SAC305. In order to reduce production costs, more and more enterprises are transitioning to low silverization and non-silverization, especially DIP. The control of the defect rate is also basically stable, but in terms of poor soldering during solder paste welding, it is unstable. However, no matter what the conversion situation is, when selecting and changing auxiliary materials in PCB processing, it is necessary to understand the melting point and design moderate temperature curve conditions. Through the correlation experiment of welding effect, the welding reliability was evaluated, and the project implementation management was specifically evaluated.
(3) Process design
The good process flow and process window design in PCBA patch processing are generally in the initial stage of product trial, and relevant technical personnel and management personnel are organized to conduct DFMEA analysis on the product. Identify potential failure issues and develop appropriate precautions. During programming and design, these issues are planned as operating standards for critical control. Effectively prevent unprepared problems from occurring. In addition, past failure cases and experiences can be directly quoted for better quality assurance. In the process design, it is necessary to monitor the possible losses, abnormalities and undesired links in order to achieve automated production and reduce product turnover.
(4) Reasonable process parameters
To fully achieve lead-free, the process window is greatly reduced during PCBA processing. In order to test the process conditions and parameters, it is recommended to use the DOE test method to optimize the process parameters. Such as speed, pressure, wiping frequency, demolding speed, reflow soldering temperature setting and other printing related parameters. DOE test method is adopted for standardized control management. It is possible to reduce quality instability due to changes in other factors.
(5) Application and design of anti-loose working device
In the SMT production process, the impact on quality is the open model and design of the steel mesh. Therefore, the choice of steel plate thickness, opening method, and size during PCBA processing, especially the control of tin beads, has always been a headache in the industry. However, there is an anti-tin bead treatment method in the design of steel plate openings, which can effectively reduce the occurrence of bad problems. It is also used for the design of special and abnormal components and PCB pads. It can do the same thing. Therefore, the mold designer needs to design according to the nature of the product, the actual condition of the part and the shape of the pad. At the same time, summarize the design experience, form standardized technical data or refer to the IPC-7525 mold design principle, and improve the welding through rate. In addition, the immersion tin immersion pad is also the root cause of directly affecting the quality of wave soldering. The choice of material, shape size, shape and size of the opening, and thickness all affect the effect of immersion in tin. Typically, designers will use assembled products. Based on in-depth design.
(6) Sufficient quality control and judgment ability
PCBA processing is based on the welding quality of the finished product, mainly in the effective use of appearance standards. The application of industrial IPC quality standards has been fully developed. In addition to better understanding the customer's product quality requirements, it is also necessary to effectively recommend IPC related standards to customers, such as IPC-A-610 electronic component acceptance conditions, IPC-A-600 PCB board acceptability, IPC-A-620 Harness Harness Harness Harness etc. c. Repair any defects that occur. Soldering processes and methods can be performed in accordance with IPC-771 1H721 electronic component rework, modification, and maintenance standards. Fully understanding the differences between customers and IPC standards and making effective judgments can reduce excess quality.
(7) Quality management system monitoring management system
PCBA processing electronic assembly and various OEM, ODM companies have basically established relevant quality control and management systems, such as IS09000, TSl6949 and other quality systems. These systems have formed a management and control system from whole to partial, but detailed and in-depth analysis and improvement of other improvements and control methods are required. At present, there are 5S management, QCC, 6e, and product pass rate. These tools and improved methods can more effectively solve difficult quality problems, especially the application of 68, and can conduct more scientific analysis of quality data and problems. When analyzing the idea of adopting the "DMAIC" process, its improvement ideas will be more convincing. Thus effectively achieving traceability of the product. Prior to PCBA processing and assembly, serial number and barcode management was also introduced to facilitate retrospective investigation of abnormal quality. At present, the better method of traceability is to print 4x4QR code on the product, read the data through the scanner, understand the product production and LOT related information, and comprehensively realize the abnormal traceability and investigation.
In order to realize the quality control of each link of PCBA processing, combined with the continuous development of the quality control system, the control methods and means of each link are particularly studied, especially the relevant parameters of the equipment and the optimized process flow. It can better use the technical force to switch to the management level, effectively manage the deposited pcba chip processing technology, and achieve on-site control standardization. In addition, the improvement of product quality is endless. In order to achieve a high-quality chip processing factory, the "zero defect" awareness is the key to decision and determination. Doing everything 100% correctly is the belief of the continuous improvement of the chip processing factory. Only high-quality manufacturing sites can achieve true zero defect.
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